The 2008 Denver X-ray Conference would like to thank the following sponsors:

Panalytical

Chemplex

Ge Inspection Technologies

Thermo

Thank you to our Media Sponsor:

Materials Today

Journal of X-Ray Science & Technology

Call for Papers:

call for papers

ANNOUNCING… ICRS-8 - The Eighth International Conference on Residual Stresses 6-8 August 2008 - Marriott Denver Tech Center Hotel - Denver, Colorado, U.S.A.

08 program

Pre registration for the Denver X-ray Conference and ICRS-8 is no longer available.

On-site registration at the Denver Marriott Tech Center Hotel will be held:

Registration Times:
Sun., 3 August            4:00 p.m.–7:00 p.m.
Mon., 4 August            8:00 a.m.–3:00 p.m.
Tues., 5 August           8:00 a.m.–3:00 p.m.
Wed., 6 August           8:00 a.m.–2:00 p.m.
Thurs., 7 August         8:00 a.m.–2:00 p.m.

The Denver Marriott Tech Center has currently sold out of rooms.
Information is listed below on area hotels. Please be sure to check with the Denver Marriott Tech Center as the conference approaches to see if there have been any cancellations. Traditionally, there are a moderate number of cancellations the week preceding the conference.

Hotels with in walking distance of The Marriott Tech Center:

  • The Hilton Garden Inn (previously Wyndham), this hotel is in the process of changing brands and may be undergoing renovations. - hiltongardeninn.hilton.com

Hotels not with in walking distance, but are still nearby:

See 2008 DXC Program (PDF)

icrs

The Eighth International Conference on Residual Stresses (ICRS-8) will take place concurrently with the Denver X-ray Conference (www.dxcicdd.com) from 6 -8 August 2008 at the Marriott Denver Tech Center Hotel, located in Denver, Colorado, U.S.A. ICRS is now held every four years; previous meetings were held in Germany (1987), France (1988), Japan (1991), U.S.A. (1994), Sweden (1997), UK (2000) and China (2004).

The conference provides a forum for scientists, academicians, students, and engineers interested in the prediction, evaluation, control, and application of residual stresses. The aim of this conference is to give equal emphasis to the measurement, modeling, and utilization of residual stress/strain data. Both the engineering and scientific aspects of these topics, such as the influence of residual stress fields on distortion, damage initiation, propagation, component lifetimes, and failure, will be addressed. Presentations on all stress determination techniques: diffraction, hole-drilling, slitting and contour, indentation, eddy current measurements, Barkhausen noise analysis, acoustic, and thermal mapping, etc., are welcome, as well as papers on the mechanics and modeling of residual stresses. Contributions from industry on residual stress applications and unsolved problems are especially encouraged.

The program will consist of invited and contributed oral presentations and posters. The conference proceedings will include most of the papers and posters presented, and will be available after the meeting on a CD-ROM.

Please visit this site often for updated information, including details on the program, registration, housing, travel and other necessary information. For information on the concurrent Denver X-ray Conference, please visit: www.dxcicdd.com.

CALL FOR PAPERS -

Deadline for abstract submission
15 March 2008

On-line abstract submission now available - SUBMIT ABSTRACT HERE

Exhibit Space Details – includes floor plan, application form and sponsorship information

Registration

On-line registration for ICRS-8 is now available. The registration fee will include access to the Denver X-ray Conference Program, including workshops, sessions, exhibits and evening receptions/poster sessions, as well as, an exclusive dinner reception for attendees of ICRS-8 on Thursday evening, August 7th.

ICRS-8 Registration Fees (includes conference dinner and proceedings on CD-ROM):

Full week: Monday & Tuesday workshops, Wednesday–Friday sessions, Monday–Thursday exhibits - $585

Half week: Wednesday–Friday sessions, Wednesday–Thursday exhibits - $535

Students: Full or half week (Identification is required) - $235

                                

CONFERENCE ORGANIZATION

The conference organization will be undertaken by the ICDD Conference Services Group, under the direction of Terry Maguire, ICDD Corporate Secretary, (maguire@icdd.com) and Denise Flaherty, ICDD Conference Coordinator, (flaherty@icdd.com), 12 Campus Boulevard, Newtown Square, PA, 19073-3273 U.S.A.

ICRS-8 Advisory Board

I. Cev Noyan
Columbia University
New York, NY, U.S.A.
E-mail: icn2@columbia.edu

Aaron Krawitz
University of Missouri
Columbia, MO, U.S.A.
E-mail: krawitza@missouri.edu

Camden R. Hubbard
Oak Ridge National Lab
Oak Ridge, TN, U.S.A.
E-mail: hubbardcr@ornl.gov

Mark Bourke
Los Alamos National Lab
Los Alamos, NM, U.S.A.
E-mail: bourke@lanl.gov

Tom Holden
Northern Stress Technologies
Deep River, Ontario, Canada
E-mail: holdent@magma.ca

ICRS-8 International Board

Prof. Zbigniew L. Kowalewski
Institute of Fundamental Technological Research P.A.S.
Warsaw, Poland
E-mail: zkowalew@ippt.gov.pl

Prof.  E.J. Mittemeijer
University of Stuttgart
Stuttgart, Germany
E-mail: e.j.mittemeijer@mf.mpg.de

Prof. Walter Reimers
Technical University Berlin
Berlin, Germany
E-mail: walter.reimers@tu-berlin.de

Prof. Berthold Scholtes (Chair)
Universität Kassel
34125 Kassel, Germany
E-mail: scholtes@uni-kassel.de

Prof. Philip J. Withers
Manchester Materials Science Center
Manchester, England, United Kingdom
E-mail: philip.withers@umist.ac.uk

Prof.  Sabine Denis
LSG2M, École des Mines de Nancy
Nancy, FRANCE
E-mail: sabine.denis@mines.inpl-nancy.fr

Dr. Jean Lou Lebrun 
LPMI, L'ecole Nationale Supérieure D'Arts et Métiers
Angers, France
E-mail: lebrun@angers.ensam.fr

Dr. Ru Lin Peng
Linköping University, Sweden
Linköping, Sweden
E-mail: rulin@ikp.liu.se

Prof. KeWei Xu
Xi’an Jiaotong University
Xi’an, P.R. China
E-mail: kwxu@mail.xjtu.edu.cn

Prof. Yoshiaki Akiniwa
Nagoya University
Nagoya, Japan
E-mail: akiniwa@mech.nagoya-u.ac.jp

Prof. Takao Hanabusa
Tokushima University
Tokushima, Japan
E-mail: hanabusa@me.tokushima-u.ac.jp

Prof. I. C. Noyan
Columbia University
New York, NY, U.S.A.
E-mail: icn2@columbia.edu

Prof. Aaron Krawitz
Univeristy of Missouri
Columbia, MO, U.S.A.
E-mail: krawitza@missouri.edu

Dr. Camden Hubbard
Oak Ridge National Lab
Oak Ridge, TN, U.S.A.
E-mail: hubbardcr@ornl.gov

Prof. Lyndon Edwards
The Open University
Milton Keynes, United Kingdom
E-mail: led@ansto.gov.au

ICRS-8 Program Committee

Michael Prime
Los Alamos National Laboratory
Los Alamos, NM, U.S.A.
E-mail: prime@lanl.gov

Ersan Ustundag
Iowa State University
Ames, IA, U.S.A.
E-mail: ustundag@iastate.edu

Mike Hill
University of California
Davis, CA, U.S.A.
E-mail: mrhill@ucdavis.edu

Jeffrey  Bunch
Boeing Integrated Defense Systems
E-mail: jeffrey.o.bunch@f22.boeing.com

Carlos Tome
Los Alamos National Laboratories
Los Alamos, NM, U.S.A.
E-mail: tome@lanl.gov

Irene Beyerlein
Los Alamos National Laboratories
Los Alamos, NM, U.S.A.
E-mail: irene@lanl.gov

Gene Ice
Oak Ridge National Laboratory
Oak Ridge, TN, U.S.A.
E-mail: icege@ornl.gov

Nobumichi Tamura
Lawrence Berkeley National Laboratory
Berkeley, CA, U.S.A.
E-mail: ntamura@lbl.gov

Joe Gray
Iowa State University
Ames, IA, U.S.A.
E-mail: jngray@iastate.edu

Thomas Watkins
Oak Ridge National Laboratory
Oak Ridge, TN, U.S.A.
E-mail: watkinstr@ornl.gov

Charles Goldsmith
IBM Corporation
Hopewell Junction, NY, U.S.A.
E-mail: cgoldsmi@us.ibm.com

Conal Murray
IBM, T.J. Watson Research Center
Yorktown Heights, NY, U.S.A.
E-mail: conal@us.ibm.com

Thomas Gnaupel-Herold
NIST, Center for Neutron Research
Gaithersburg, MD, U.S.A.
E-mail: tg-h@nist.gov

Donald Brown
Los Alamos National Laboratory
Los Alamos, NM, U.S.A.
E-mail: dbrown@lanl.gov

Xun-Li Wang
Oak Ridge National Laboratory
Oak Ridge, TN, U.S.A.
E-mail: wangxl@ornl.gov

Jon Almer
Argonne National Laboratory
Argonne, IL, U.S.A.
E-mail: almer@aps.anl.gov

Mark Daymond
Queen's University
Kingston, Ontario, CANADA
E-mail: daymond@me.queensu.ca

Jeremy Robinson
University of Limerick
Limerick, Ireland
jeremy.robinson@ul.ie

 

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